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US 10,703,939 B2Granted
Acrylic composition for sealing, sheet material, multilayer sheet, cured product, semiconductor device and method for manufacturing semiconductor device
AssigneePanasonic Intellectual Property Management Co., Ltd.
InventorsKazuki Watanabe, Shigeru Yamatsu, Naoki Kanagawa, Daisuke Sasaki
Life of this patent
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Abstract
The acrylic composition for sealing contains an acrylic compound, a polyphenylene ether resin including a radical-polymerizable substituent at a terminal, an inorganic filler, a thermal radical polymerization initiator, and a thermoplastic resin.
Claims15
An acrylic composition for sealing, the acrylic composition comprising:
- an acrylic compound;
- a polyphenylene ether resin including a radical-polymerizable substituent at a terminal;
- an inorganic filler;
- a thermal radical polymerization initiator;
- and
- a thermoplastic resin.
3 more elements
Dependencies are inferred from the claim text.