Resin composition and article made therefrom
AssigneeElite Electronic Material (Zhongshan) Co., Ltd.
InventorsZhilong Hu, Licheng Lin
Life of this patent
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Abstract
Disclosed is a resin composition, which comprises 30 parts by weight to 90 parts by weight of a maleimide resin and 15 parts by weight to 60 parts by weight of a benzoxazine resin. The resin composition may be fabricated into various articles, such as prepregs, prepregs with copper foil, resin films, resin films with copper foil, laminates or printed circuit boards, which possess at least one, more or all of the following properties: high peel strength, high thermal resistance after moisture absorption, high glass transition temperature, low thermal expansion, high thermal resistance, low dielectric constant, low dissipation factor and so on.
Claims15
A resin composition, comprising 30 parts by weight to 90 parts by weight of a maleimide resin and 15 parts by weight to 60 parts by weight of a benzoxazine resin, wherein the benzoxazine resin comprises an oxydianiline benzoxazine resin and an unsaturated bond-containing benzoxazine resin, and a weight ratio of the oxydianiline benzoxazine resin to the unsaturated bond-containing benzoxazine resin is between 1:2 and 9:1, and wherein the unsaturated bond-containing benzoxazine resin comprises an allyl-modified dicyclopentadiene phenol benzoxazine resin.
A resin composition, comprising 10 parts by weight to 65 parts by weight of epoxy resin, 30 parts by weight to 90 parts by weight of a maleimide resin and 15 parts by weight to 60 parts by weight of a benzoxazine resin, wherein:
- the benzoxazine resin comprises an oxydianiline benzoxazine resin and an unsaturated bond-containing benzoxazine resin, and a weight ratio of the oxydianiline benzoxazine resin to the unsaturated bond-containing benzoxazine resin is between 1:2 and 9:1, and wherein the unsaturated bond-containing benzoxazine resin comprises an allyl-modified dicyclopentadiene phenol benzoxazine resin;
- and
- a weight ratio of the maleimide resin to the epoxy resin is between 5:1 and 1:1.
Dependencies are inferred from the claim text.