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US 10,703,874 B2Granted
Resin composition, prepreg or resin sheet comprising the resin composition, and laminate and printed circuit board comprising them
AssigneeMitsubishi Gas Chemical Company, Inc.
InventorsYoichi Takano, Nobuyoshi Ohnishi, Katsuya Tomizawa, Naoki Kashima, Hiroshi Takahashi, Eisuke Shiga
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Abstract
The resin composition of the present invention comprises an alkenyl-substituted nadimide (A), a maleimide compound (B), and an amino-modified silicone (C).
Claims13
A resin composition comprising an alkenyl-substituted nadimide (A), a maleimide compound (B-2), and a prepolymer (P) which is a reaction product of a maleimide compound (B-1) with an amino-modified silicone (C);
- wherein the maleimide compound (B-1) is at least one compound selected from the group consisting of 2,2-bis(4-(4-maleimidophenoxy)-phenyl)propane and bis(3-ethyl-5-methyl-4-maleimidophenyl)methane, and
- wherein the maleimide compound (B-2) is at least one compound selected from the group consisting of polytetramethylene oxide-bis(4-maleimidobenzoate) and a maleimide compound represented by formula (6):
- wherein each R5 independently represents a hydrogen atom or a methyl group, and n1 represents an integer of 1 or larger.
Dependencies are inferred from the claim text.