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US 10,703,855 B2Granted
Resin composition, prepreg, metal-foil-clad laminate, resin sheet, and printed circuit board
AssigneeMitsubishi Gas Chemical Company, Inc.
InventorsShota Koga, Daisuke Ueyama, Kentaro Takano
Life of this patent
Estimating the term…
Abstract
A resin composition containing: an epoxy resin (A) represented by the following formula (1); and a cyanate compound (B), wherein Ar represents a polycyclic aromatic group, R represents a hydrogen atom or a methyl group, G represents a glycidyl group, and n represents an integer of 0 to 15.
Claims19
A resin composition comprising:
- an epoxy resin (A) represented by the following formula (1-1);
- and
- a cyanate compound (B),
- wherein n represents an integer of 0 to 15.
1 more element
Dependencies are inferred from the claim text.