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US 10,703,854 B2Granted
Epoxy formula for integral capacitance probe
AssigneeRaytheon Technologies Corporation
InventorsEli Cole Warren, Peter J. Walsh
Life of this patent
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Abstract
An epoxy composition may comprise a resin composition comprising a diglycidyl ether of bisphenol AF and at least one of a filler, a fire resistant component, a chain extender, a conductivity modifier, and a dye. The resin composition may further comprise at least one diglycidyl ether of bisphenol A and bisphenol F.
Claims17
A curable epoxy resin composition, comprising:
- between 40% and 70% by weight of a resin composition;
- a curative;
- an additive;
- between 10% and 30% by weight of a brominated fire resistant epoxy resin;
- between 1% and 5% by weight of antimony trioxide, and less than 0.1% by weight of dye and/or trace reaction products;
- wherein the resin composition comprises a diglycidyl ether of bisphenol AF, represented by formula (1):
- wherein the additive is selected from the group consisting of a non-conductive additive and a conductive additive;
- wherein the non-conductive additive consists of a non-conductive filler composition, provided in an amount of between 10% and 30% by weight of the curable epoxy resin composition;
- and
- wherein the conductive additive consists of a conductivity modifier, provided in an amount between 10% and 30% by weight of the curable epoxy resin composition, and an optional non-conductive filler composition, provided in an amount of up to 30% by weight of the curable epoxy resin composition.
7 more elements
Dependencies are inferred from the claim text.