Mounting pedestal, component mounting module, and moving body
AssigneePanasonic Intellectual Property Management Co., Ltd.
InventorsTomoyuki Nakano, Takahiro Miyake, Yoshihiro Kawakita, Takashi Matsuda, Masahiro Kasano
Life of this patent
Estimating the term…
Abstract
A mounting pedestal on which a heat generating component is disposed is provided. The mounting pedestal includes a substrate which includes a plurality of bending portions at which the substrate is bent in a staircase shape. An insulating layer is disposed on a surface of the substrate. An interconnecting line is disposed on the insulating layer. In the mounting pedestal, the interconnecting line extends across the plurality of bending portions. In each of the plurality of bending portions, a corner radius (R) of a mountain portion is greater than a corner R of a valley portion.
Claims24
A mounting pedestal on which a heat generating component is disposed, the mounting pedestal comprising:
- a substrate which includes a plurality of bending portions at which the substrate is bent in a staircase shape;
- an insulating layer disposed on a surface of the substrate;
- and
- an interconnecting line disposed on the insulating layer, wherein
- the interconnecting line extends across the plurality of bending portions, and
- in each of the plurality of bending portions, a corner radius (R) of a mountain portion is greater than a corner R of a valley portion.
Dependencies are inferred from the claim text.