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US 10,702,970 B2Granted
Polishing pad and polishing apparatus
AssigneeSan Fang Chemical Industry Co., Ltd.
InventorsChung-Chih Feng, I-Peng Yao, Lyang-Gung Wang, Wei-Te Liu, Wen-Chieh Wu, Yung-Chang Hung
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Abstract
The present invention relates to a polishing having a polishing layer, an elastic base layer and a binder layer. The binder layer binds the elastic base layer to the polishing layer. A compressibility of the elastic base layer is greater than a compressibility of the polishing layer. The present invention further provides a polishing apparatus and a method for polishing a substrate.
Claims18
A polishing pad comprising:
- a polishing layer including a first polymeric elastomer and a plurality of first pores;
- at least one elastic base layer including a second polymeric elastomer and a plurality of second pores, wherein the second pores are substantially in columnar shape, each of the second pores has a top portion and a bottom portion, the bottom portion is closed, the top portion is an opening on a surface of the elastic base layer, and a diameter of the bottom portion is greater than a diameter of the top portion;
- and
- a binder layer binding the elastic base layer to the polishing layer;
- wherein a compressibility of the elastic base layer is greater than a compressibility of the polishing layer;
- and
- further includes a film with low permeability, wherein the elastic base layer has a first surface binding to the polishing layer and a second surface opposite the first surface, and the film with low permeability contacts the second surface of the elastic base layer.
4 more elements
Dependencies are inferred from the claim text.