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US 10,702,954 B2Granted
Conductive paste
AssigneeNamics Corporation
InventorYoshiaki Yoshii
Life of this patent
Estimating the term…
Abstract
A conductive paste including (A) a silver powder, (B) a glass frit, (C) an organic binder and (D) a powder containing Cu and at least one metal element selected from the group consisting of V, Cr, Mn, Fe and Co. The powder (D) may thus contain Cu and Mn, Cu and Fe or Cu and Co. The conductive paste has a desirable electromigration resistance, solder heat resistance and adhesiveness to a substrate.
Claims20
A conductive paste which comprises the following components (A) to (D):
- (A) a silver powder;
- (B) a glass frit;
- (C) an organic binder;
- and
- (D) an alloy powder containing Cu and Mn,
- wherein the alloy powder (D) is contained in an amount of 0.1 to 5.0 parts by mass based on 100 parts by mass of the silver powder (A), and
- wherein a mass ratio of Mn to Cu is 0.01 to 2.5:1.
4 more elements
Dependencies are inferred from the claim text.