Substrate processing method

A method of processing a substrate, having a first surface with at least one division line formed thereon and a second surface opposite the first surface the method comprising:

• applying a pulsed laser beam to the substrate from the side of the first surface, wherein the substrate is made of a material which is transparent to the pulsed laser beam and the pulsed laser beam is applied to the substrate at least in a plurality of positions along the at least one division line, in a condition where a focal point of the pulsed laser beam is located at a distance from the first surface in the direction from the first surface towards the second surface, so as to form a plurality of modified regions inside the substrate along the at least one division line, the plurality of modified regions being formed inside the substrate so that adjacent modified regions do not overlap each other in the extension direction of the at least one division line, each modified region being arranged entirely within the bulk of the substrate, without forming any openings open to the first surface or the second surface;
• and
• removing substrate material along the at least one division line where the modified regions arranged entirely within the bulk of the substrate are present.