Composition for producing fillers and method for producing and processing the fillers

A composition for producing a putty, the composition consisting of:

• a binder component comprising 40 to 95 wt.-% of an epoxy resin based on a total mass of the binder component;
• a hardener component comprising 5 to 70 wt.-% of an NH-group-containing compound relative to a total mass of the hardener component;
• 0.1 to 15 wt.-% of synthetic hollow bodies based on a total mass of the putty, the synthetic hollow bodies having a density of 0.005 to 0.8 g/cm3;
• up to 90 wt.-% of a filling material relative to the total mass of the putty;
• up to 80 wt.-% of an anorganic pigment relative to the total mass of the putty;
• and
• up to 15 wt.-% of an additive,
• wherein,
• the filling material is selected from talcum, quartz flour, kaolin, dolomite, barium sulphate, calcium carbonate, calcite, cristobalite flour, silica, wollastonite flour, and mixtures thereof,
• the anorganic pigments is selected from a titanium oxide, an iron oxide, an iron hydroxide, and a chrome oxide, and
• the additive is selected from a thixtrophatation agent, a wax, a molecular sieve, a defoamer, a bleeder, a rheology additive, a plasticizer, a dispersing additive, an accelerator, a surface additive, a flow additive, and a cross-linking additive.