Thermal conduction principle and device for intercrossed structure having different thermal characteristics

A multi-layer thermally conductive structure including a plurality of partially overlapping conductors having different thermal conducting characteristics, comprising:

• a relay thermal conductor (102) having a first surface that directly contacts and is thermally coupled with a first thermal body (101) and a second surface opposite and spaced from the first surface;
• an interface thermal conductor (103) between said relay thermal conductor (102) and a second thermal body (104), said second thermal body (104) directly contacting only the interface thermal conductor (103) and not the relay thermal conductor (102), said interface thermal conductor (103) having a first surface that directly contacts and is thermally coupled with the second thermal body (104) and a second surface that directly contacts the second surface of the relay thermal conductor (102), said relay thermal conductor (102) and interface thermal conductor (103) conducting heat between the first thermal body (101) and the second thermal body (104) when there is a temperature difference between the first thermal body (101) and the second thermal body (104), and said relay thermal conductor (102) and interface thermal conductor (103) having one of the following thermal characteristics:
• (i) said interface thermal conductor having a higher specific heat capacity than the relay thermal conductor (102);
• (ii) said interface thermal conductor having a coefficient of heat transfer to the second thermal body (104) that is higher than a coefficient of thermal transfer from the relay thermal conductor (102) to the second thermal body (104);
• and
• (iii) said interface thermal conductor having a higher thermal emissivity to the second thermal body (104) than the relay thermal conductor (102),
• wherein the first thermal body (101) is either a heat absorber or a heat source and the second thermal body (104) is also either a heat absorber or a heat source,
• wherein relative contact areas between the relay thermal conductor (102), the interface thermal conductor (103), and the first and second thermal bodies determines thermal conduction properties of the multi-layer thermally conductive structure,
• wherein the first thermal body (101) includes a first section that directly contacts said first surface of the relay thermal conductor (102) and a central second section that extends through the relay thermal conductor (102) to directly contact the interface thermal conductor (103), and
• wherein the thermally conductive structure is applied to cookware that lacks a lid or is equipped with a liftable lid.

A multi-layer thermally conductive structure including a plurality of partially overlapping conductors having different thermal conducting characteristics, comprising:

• a relay thermal conductor (102) having a first surface that directly contacts and is thermally coupled with a first thermal body (101);
• an interface thermal conductor (103) between said relay thermal conductor (102) and a second thermal body (104), said second thermal body (104) directly contacting only the interface thermal conductor (103) and not the relay thermal conductor (102), said interface thermal conductor (103) having a first surface that directly contacts and is thermally coupled with the second thermal body (104) and a second surface that directly contacts the second surface of the relay thermal conductor (102), said relay thermal conductor (102) and interface thermal conductor (103) conducting heat between the first thermal body (101) and the second thermal body (104) when there is a temperature difference between the first thermal body (101) and the second thermal body (104), and said relay thermal conductor (102) and interface thermal conductor (103) having one of the following thermal characteristics:
• (i) said interface thermal conductor having a higher specific heat capacity than the relay thermal conductor (102);
• (ii) said interface thermal conductor having a coefficient of heat transfer to the second thermal body (104) that is higher than a coefficient of thermal transfer from the relay thermal conductor (102) to the second thermal body (104);
• and
• (iii) said interface thermal conductor having a higher thermal emissivity to the second thermal body (104) than the relay thermal conductor (102),
• wherein the first thermal body (101) is either a heat absorber or a heat source and the second thermal body (104) is also either a heat absorber or a heat source, and
• wherein relative contact areas between the relay thermal conductor (102), the interface thermal conductor (103), and the first and second thermal bodies determines thermal conduction properties of the multi-layer thermally conductive structure, and
• wherein the first thermal body (101) includes a first section that directly contacts said first surface of the relay thermal conductor and a central second section that extends through the relay thermal conductor (102) to directly contact the interface thermal conductor (103), and
• further comprising an auxiliary thermal conductor installed between the first thermal body (101) and the relay thermal conductor (102), between the relay thermal conductor (102) and the interface thermal conductor (103), or between the interface thermal conductor (103) and the second thermal body (104), said auxiliary thermal conductor including one of an electrically insulated heat conductive piece, a thermally conductive grease coating, and an electrically insulated thermally conductive piece coated with thermally conductive grease.