US 10,689,550 B2 · Electrically conductive composition

Abstract

A composition exhibits excellent heat resistance and mounting reliability when bonding a semiconductor power element to a metal lead frame, which is also free of lead and thereby places little burden on the environment. An electrically conductive composition contains at least a sulfide compound represented by R—S—R′ (wherein R is an organic group containing at least carbon; R′ is an organic group that is the same as or different from R; and R and R′ may be bonded to each other to form a so-called cyclic sulfide) and metal particles containing at least Cu, Sn or Ni as its essential component. Further, a conductive paste and a conductive bonding film each are produced using the electrically conductive composition. A dicing die bonding film is obtained by bonding the conductive bonding film with an adhesive tape.

Claims13

Dependent claims

An electrically conductive composition, which comprises a sulfide compound expressed by the following general formula (1)

R—S—R′ General Formula (1)
wherein R is an organic group that contains at least carbon;
R′ is an organic group that is the same as or different from R;
R and R′ may be bonded, and wherein the sulfide compound is a compound that contains at least one acryloyl group;
metal particles that contain at least one of Cu, Sn or Ni as essential components;
and
a thermosetting resin, wherein the thermosetting resin comprises a maleic imide compound that contains two or more units of imide groups in one molecule.

4 more elements

Dependencies are inferred from the claim text.

Electrically conductive composition

Life of this patent

Electrically conductive composition

Life of this patent

Abstract

Claims13