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US 10,688,578 B2Granted
Variable temperature controlled soldering iron
AssigneeOK International, Inc.
InventorHoa Nguyen
Life of this patent
Estimating the term…
Abstract
An intelligent soldering handpiece comprising a housing; a solder tip; a heater for heating the solder tip; a processor for receiving an image of a solder joint being soldered by the intelligent soldering handpiece, determining solder joint information, and associating the image of the solder joint with the determined solder joint information to distinguish the determined solder joint information for each respective joint.
Claims12
An intelligent soldering handpiece, comprising:
- a housing;
- a solder tip;
- a heater for heating the solder tip;
- wherein the intelligent soldering handpiece includes a processor configured to:
- receive an image of a solder joint being soldered by the intelligent soldering handpiece,
- determine solder joint information, the determined solder joint information is one or more of liquidus temperature, temperature of the solder tip, information about a change in temperature over time for various load sizes, tip geometry, number of soldering events that have been performed by a specific tip, the intelligent soldering handpiece includes a cartridge and determined solder joint information is at least one of date of manufacturing of the cartridge, serial number and identification code for the cartridge, part-number, and CV selection flag, the determined solder joint information is data checksum, the determined solder joint information is detecting liquidus occurrence at a solder joint, and an indication signal indicating that a reliable solder joint connection is formed,
- associate the image of the solder joint with the determined solder joint information,
- whereby the determined solder joint information for each respective joint is distinguished.
5 more elements
An intelligent soldering handpiece, comprising:
- a housing;
- a solder tip;
- a heater for heating the solder tip;
- wherein the intelligent soldering handpiece includes a processor configured to:
- receive an image of a solder joint being soldered by the intelligent soldering handpiece,
- determine solder joint information,
- associate the image of the solder joint with the determined solder joint information,
- whereby the determined solder joint information for each respective joint is distinguished,
- wherein the processor determines a thickness of an intermetallic compound (IMC) of a solder joint being formed by the solder tip, generates an indication signal indicating that a reliable solder joint connection is formed when the thickness of the IMC is within a predetermined range, and associates the image of the solder joint with the indication signal.
6 more elements
An intelligent soldering handpiece, comprising:
- a housing;
- a solder tip;
- a heater for heating the solder tip;
- wherein the intelligent soldering handpiece includes a processor configured to:
- receive an image of a solder joint being soldered by the intelligent soldering handpiece,
- determine solder joint information,
- associate the image of the solder joint with the determined solder joint information,
- whereby the determined solder joint information for each respective joint is distinguished,
- wherein the intelligent soldering handpiece includes a cartridge and determined solder joint information is at least one of date of manufacturing of the cartridge, serial number and identification code for the cartridge, part-number, and CV selection flag.
6 more elements
An intelligent soldering handpiece, comprising:
- a housing;
- a solder tip;
- a heater for heating the solder tip;
- wherein the intelligent soldering handpiece includes a processor configured to:
- receive an image of a solder joint being soldered by the intelligent soldering handpiece,
- determine solder joint information,
- associate the image of the solder joint with the determined solder joint information,
- whereby the determined solder joint information for each respective joint is distinguished,
- wherein the determined solder joint information is an indication signal indicating that a reliable solder joint connection is formed.
6 more elements
Dependencies are inferred from the claim text.