Pressure-sensitive adhesive composition, pressure-sensitive adhesive film, and method of manufacturing organic electronic device using the same

A pressure-sensitive adhesive composition comprising an encapsulating resin comprising a copolymer of a diene and an olefin-based compound haying one carbon-carbon double bond, a tackifier and an active energy rav-polymerizable compound included at 5 to 18 parts by weight relative to 100 parts by weight of the encapsulating resin, wherein the active energy ray-polymerizable compound satisfies Formula 1:

• where R1 is hydrogen or an alkyl group having 1 to 4 carbon atoms, n is an integer of 2 or more, and X is a residue inducted from a linear, branched, or cyclic alkyl group having 3 to 30 carbon atoms, wherein the pressure sensitive adhesvie composition has a gel content represented by Equation 1 of 50% or more, a micro gel content represented by Equation 2 of 3% or less, and a water vapor transmission rate in a thickness direction while being formed in a film having a thickness of 100 μm of 50 g/m2, day or less:
• Gel content (wt %)=B/A×100 [Equation 1]
• Micro gel content (wt %)=C/A×100 [Equation 2]
• wherein in Equations 1 and 2, A is a mass of the pressure-sensitive adhesive composition,
• in Equation 1, B is a dry mass of an insoluble content of the pressure-sensitive adhesive composition remaining after being dipped in toluene at 60° C. for 24 hours and filtered through a 200-mesh sieve (pore size of 200 μm), and
• in Equation 2, C is a dry mass of an insoluble content of the pressure-sensitive adhesive composition remaining after being dipped in toluene at 60° C. for 24 hours, primarily filtered through a 200-mesh sieve (pore size:
• 200 μm), and secondarily filtered through a 1000-mesh sieve (pore size:
• 5 μm).