Polyamide molding compounds and molded articles produced therefrom

A polyamide moulding compound having the following composition:

• (A) 25 to 84.99% by weight of at least one caprolactam-containing polyamide (A1) with a caprolactam content of at least 50% by weight and at least one further polyamide (A2), wherein the at least one polyamide (A2) has a melting point in the range of 250 to 340° C.,
• (B) 15 to 70% by weight of at least one filler and reinforcing means,
• (C) 0.01 to 5.0% by weight of at least one inorganic radical interceptor lanthanum oxide,
• (D) 0 to 5.0% by weight of at least one heat stabilizer which differs from inorganic radical interceptor (C), selected from the group consisting of
• (a) compounds of mono- or bivalent copper,
• (b) stabilisers based on secondary aromatic amines,
• (c) stabilisers based on sterically hindered phenols,
• (d) phosphites and phosphonites, and
• (e) mixtures thereof, and
• (E) 0 to 20.0 by weight of at least one additive, components (A) to (E) adding up to 100% by weight.