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AssigneeMicrofabrica Inc.
InventorsAdam L. Cohen, Michael S. Lockard, Kieun Kim, Qui T. Le, Gang Zhang, Uri Frodis, Dale S. McPherson, Dennis R. Smalley
Estimating the term…
Some embodiments are directed to techniques for building single layer or multi-layer structures on dielectric or partially dielectric substrates. Certain embodiments deposit seed layer material directly onto substrate materials while others use an intervening adhesion layer material. Some embodiments use different seed layer and/or adhesion layer materials for sacrificial and structural conductive building materials. Some embodiments apply seed layer and/or adhesion layer materials in what are effectively selective manners while others apply the materials in blanket fashion. Some embodiments remove extraneous material via planarization operations while other embodiments remove the extraneous material via etching operations. Other embodiments are directed to the electrochemical fabrication of multilayer mesoscale or microscale structures which are formed using at least one conductive structural material, at least one conductive sacrificial material, and at least one dielectric material. In some embodiments the dielectric material is a UV-curable photopolymer.
A batch process for forming a plurality of multilayer three-dimensional structures, comprising:
A batch process for forming a plurality of multilayer three-dimensional structures, comprising:
A batch process for forming a plurality of multilayer three-dimensional structures on a substrate, comprising:
A batch process for forming a plurality of multilayer three-dimensional structures on a substrate, comprising:
Dependencies are inferred from the claim text.