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US 10,676,579 B2Granted
Resin composition, prepreg, resin sheet, metal foil-clad laminate, and printed circuit board
AssigneeMitsubishi Gas Chemical Company, Inc.
InventorsKatsuya Tomizawa, Yoichi Takano, Meguru Ito, Eisuke Shiga
Life of this patent
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Abstract
It is intended to provide a resin composition that serves as a raw material for a printed circuit board excellent in heat resistance after moisture absorption and is excellent in moldability. The resin composition of the present invention contains a maleimide compound, a silane compound having a carbon-carbon unsaturated bond and a hydrolyzable group or a hydroxy group, a silane compound having an epoxy skeleton and a hydrolyzable group or a hydroxy group, and an inorganic filler.
Claims16
A resin composition comprising:
- a maleimide compound,
- a silane compound having a carbon-carbon unsaturated bond and a hydrolyzable group or a hydroxy group,
- a silane compound having an epoxy skeleton and a hydrolyzable group or a hydroxy group, and
- an inorganic filler;
- wherein the silane compound having an epoxy skeleton and a hydrolyzable group or a hydroxy group is a compound represented by the following formula (D):
- where:
- R10 represents the hydrolyzable group or the hydroxy group;
- R11 represents a hydrogen atom or an alkyl group having 1 to 3 carbon atoms;
- when a plurality of R10 or R11 are present, the plurality of R10 or R11 are the same as or different from each other;
- R12 represents an alkylene group having 1 to 10 carbon atoms;
- and
- m represents an integer of 1 to 3.
9 more elements
Dependencies are inferred from the claim text.