Molding processes for metallic foams, apparatuses, and products
AssigneeFourté International, SDN. BHD
InventorsJames J. Farquhar, Darryl G. McBride
Life of this patent
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Abstract
Embodiments of the present technology include molding processes for metallic foams, apparatuses, and products. An example method includes placing an uncompressed charge of conductive metal foam into a cavity disposed on a first tool, wherein the first tool is located on a first portion of a compression mold apparatus, translating the first portion of the compression mold apparatus towards a second portion of the compression mold apparatus so as to compress the uncompressed charge of conductive metal foam, creating a compressed charge of conductive metal foam, and overmolding around and through the compressed charge of conductive metal foam with an overmolding material.
Claims8
A method, comprising:
- placing a charge of conductive metal foam into a mold cavity of a first tool, wherein the first tool is located on a first portion of a compression molding apparatus, further wherein the mold cavity is defined by a lower surface that comprises a first plurality of pinch pins;
- translating the first portion of the compression molding apparatus into a second portion of the compression molding apparatus to compress the charge of the conductive metal foam, the second portion comprising a second plurality of pinch pins that align with the first plurality of pinch pins;
- wherein the second plurality of pinch pins and the first plurality of pinch pins compress and suspend the charge of the conductive metal foam;
- and
- introducing an overmolding material into a space created by suspension of the charge of the conductive metal foam, wherein the overmolding material saturates the charge of the conductive metal foam.
Dependencies are inferred from the claim text.