Amplifiers with in-package radial stub harmonic traps
AssigneeNXP USA, Inc.
InventorsRamanujam Srindhi Embar, Roy McLaren
Life of this patent
Estimating the term…
Abstract
An amplifier package may include a transistor, an output impedance matching circuit and one or more radial stub harmonic traps coupled to a control terminal of the transistor or to an output terminal of the transistor. The output impedance matching circuit and the radial stub harmonic traps may be formed on a single substrate or separate substrates, which may be formed from gallium nitride. Each radial stub harmonic trap may provide a low resistance path to ground for signal energy above a fundamental operating frequency of the amplifier, such as harmonic frequencies thereof.
Claims18
An amplifier package comprising:
- a conductive housing comprising a ground-plane;
- and
- an integrated circuit die disposed on an upper surface of the ground-plane, the integrated circuit die comprising:
- a semiconductor substrate disposed on the upper surface of the ground-plane;
- a transistor formed from the semiconductor substrate, the transistor having a control terminal and an output terminal each disposed directly on the semiconductor substrate;
- a radial stub harmonic trap comprising a patterned metal layer that is disposed on and in direct physical contact with an upper surface of the semiconductor substrate;
- and
- an on-chip interconnect formed on the semiconductor substrate, wherein the on-chip interconnect couples the radial stub harmonic trap to the transistor.
A packaged radio frequency (RF) amplifier device comprising:
- a conductive ground-plane;
- a semiconductor substrate disposed on an upper surface of the ground-plane;
- a transistor that is formed at least partially from the semiconductor substrate and that includes a control terminal and an output terminal each disposed directly on the semiconductor substrate;
- and
- a radial stub harmonic trap that is formed on the top surface of the semiconductor substrate and that is electrically connected to the transistor.
An electronic device comprising:
- a ground-plane;
- a semiconductor substrate disposed on an upper surface of the ground-plane, such that a lower surface of the semiconductor substrate is directly attached to the upper surface of the ground-plane;
- a transistor that is formed from the semiconductor substrate, and that includes a control terminal and an output terminal each disposed directly on the semiconductor substrate;
- a first radial stub that is formed on an upper outer surface of the semiconductor substrate and that is electrically connected to the transistor;
- and
- a second radial stub that is formed on the upper outer surface of the semiconductor substrate and that is electrically connected to the transistor.
Dependencies are inferred from the claim text.