Long-chain alkylene group-containing epoxy resin composition
AssigneeNissan Chemical Industries, Ltd.
InventorsTakeshi Suwa, Yuki Endo, Sayoko Tadokoro
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Abstract
There is provided an epoxy resin composition containing an epoxy compound, which has a low viscosity and a low dielectric constant, and when added to a general-purpose epoxy resin composition, can lower a viscosity of the composition and can sufficiently lower a dielectric constant of an epoxy resin cured product obtained from the composition. An epoxy resin composition comprising: (a) an epoxy component containing at least an epoxy compound of formula [1]; and (b) a curing agent: wherein R1 to R3 each independently are a hydrogen atom or methyl group, and L1 to L3 each independently are pentamethylene group, hexamethylene group or heptamethylene group.
Claims7
An epoxy resin composition comprising:
- (a) an epoxy component containing at least an epoxy compound of formula [1];
- and
- (b) a curing agent,
- where:
- each of R1 to R3 is a hydrogen atom, and
- each of L1 to L3 each is a hexamethylene group, and
- wherein the epoxy resin composition optionally includes an acid generator as a curing catalyst in addition to the curing agent but not as the curing agent.
Dependencies are inferred from the claim text.