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US 10,669,007 B2Granted
Method and apparatus for attaching components having dissimilar rates of thermal expansion
AssigneeRaytheon Technologies Corporation
InventorsWendell V. Twelves, Kathleen E. Sinnamon
Life of this patent
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Abstract
An example method of mounting a first component to a second component includes receiving at least a fastening assembly within an aperture established in the first component, the fastening assembly coupled to the second component via a linking member, positioning a felt metal material between the fastening assembly and the first component, securing the fastening assembly, and compressing the felt metal material during the securing.
Claims20
A method of mounting a first component to a second component, comprising:
- receiving at least a fastening assembly within an aperture established in the first component, the fastening assembly coupled to the second component via a linking member;
- positioning a felt metal material between the fastening assembly and the first component;
- securing the fastening assembly;
- and
- compressing the felt metal material during the securing.
2 more elements
Dependencies are inferred from the claim text.