Application specific electronics packaging systems, methods and devices
AssigneeMolex Incorporated
InventorsMarko Spiegel, Victor Zaderej, Amrit Panda
Life of this patent
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Abstract
Depicted embodiments are directed to an Application Specific Electronics Packaging (“ASEP”) system, which enables the manufacture of additional products using reel to reel (68a, 68b) manufacturing processes as opposed to the “batch” processes used to currently manufacture electronic products and MIDs. Through certain ASEP embodiments, it is possible to integrate connectors, sensors, LEDs, thermal management, antennas, RFID devices, microprocessors, memory, impedance control, and multi-layer functionality directly into a product.
Claims17
A method of manufacturing electronic devices comprising:
- forming a continuous carrier formed of an electrically conductive material;
- molding a plurality of non-conductive substrates onto the carrier;
- forming traces on the substrates;
- electroplating the traces;
- electrically attaching components to the traces to form a plurality of devices;
- singulating one of the devices from the remainder of the carrier, wherein pockets are molded into the substrates such that portions of the carrier are exposed and vias are formed within at least one of the pockets.
A device comprising:
- a singulated carrier portion;
- a substrate molded onto the singulated carrier portion;
- seed layer traces on the substrate;
- plated metal traces on the seed layer traces;
- and
- a component electrically attached to at least one plated metal trace, wherein a pocket is formed into the substrate such that a portion of the singulated carrier portion is exposed and a via is formed within the pocket.
A device comprising:
- a singulated carrier portion;
- a substrate molded onto the singulated carrier portion;
- conductive traces formed on the substrate with a laser and electroplating;
- a component electrically coupled to at least one of the conductive traces, wherein the pocket is formed into the substrate such that a portion of the singulated carrier portion is exposed and a via is formed within the pocket.
Dependencies are inferred from the claim text.