US 10,665,785 B2Granted

Mask for deposition and method of manufacturing the same

AssigneeSamsung Display Co., Ltd.

InventorsYoungdae Kim, Sangjin Park, Minjae Jeong

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Abstract

A method of manufacturing a mask includes attaching a first mask base substrate and a second mask base substrate to opposite sides of an adhesive layer, forming a photoresist layer on the first and second mask base substrates, exposing and developing the photoresist layer to remove the photoresist layer on effective area at centers of surfaces of the first and second mask base substrates such that the first photoresist layer remains on non-effective areas at edges of surfaces of the first mask base substrate and the second mask base substrate, etching the effective area to form a stepped groove on the first and second mask base substrates, separating the first and second mask base substrates from the adhesive layer, and forming a pattern hole in the effective area of first and second mask base substrates, each with the first stepped groove thereon.

Claims20

Dependent claims

A method of manufacturing a mask for deposition, the method comprising:

attaching a bottom surface of a first mask base substrate to a top surface of an adhesive layer and attaching a top surface of a second mask base substrate to a bottom surface of the adhesive layer;
forming a first photoresist layer on a top surface of the first mask base substrate and on a bottom surface of the second mask base substrate;
exposing and developing the first photoresist layer to remove a portion of the first photoresist layer on an effective area located in a center of the top surface of the first mask base substrate and in a center of the bottom surface of the second mask base substrate, while allowing a portion of the first photoresist layer on a non-effective area at an edge of the top surface of the first mask base substrate and at an edge of the bottom surface of the second mask base substrate to remain;
etching the effective area to form a first stepped groove on the top surface of the first mask base substrate and on the bottom surface of the second mask base substrate;
removing the portion of the first photoresist layer remaining on the non-effective area;
separating the first mask base substrate and the second mask base substrate from the adhesive layer;
and
after separating the first mask base substrate and the second mask base substrate from the adhesive layer, forming a pattern hole in the effective area of each of the first mask base substrate and the second mask base substrate, each with the first stepped groove thereon.

5 more elements

A method of manufacturing a mask for deposition, the method comprising:

attaching a bottom surface of a first mask base substrate onto a top surface of an adhesive layer and attaching a top surface of a second mask base substrate onto a bottom surface of the adhesive layer;
forming a first photoresist layer on each of a top surface of the first mask base substrate and a bottom surface of the second mask base substrate;
exposing and developing the first photoresist layer to remove a portion of the first photoresist layer on an effective area located in a center of each of the top surface of the first mask base substrate and the bottom surface of the second mask base substrate, while allowing a portion of the first photoresist layer on a non-effective area, other than the effective area, to remain near an edge of each of the top surface of the first mask base substrate and the bottom surface of the second mask base substrate;
etching the effective area to form a first stepped groove in each of the top surface of the first mask base substrate and the bottom surface of the second mask base substrate;
removing the portion of the first photoresist layer remaining on the non-effective area;
separating the first mask base substrate and the second mask base substrate from the adhesive layer;
after separating the first mask base substrate and the second mask base substrate from the adhesive layer, forming a second photoresist layer on each of the bottom surface of the first mask base substrate and the top surface of the second mask base substrate;
exposing and developing the second photoresist layer to remove a portion of the second photoresist layer on an effective area located in a center of each of the bottom surface of the first mask base substrate and the top surface of the second mask base substrate, while allowing a portion of the second photoresist layer on a non-effective area, other than the effective area, to remain near an edge of the bottom surface of the first mask base substrate and the top surface of the second mask base substrate;
etching the effective area to form a second stepped groove on each of the bottom surface of the first mask base substrate and the top surface of the second mask base substrate;
removing the portion of the second photoresist layer remaining on the non-effective area;
and
forming a pattern hole in the effective area of each of the first mask base substrate having the first stepped groove thereon and the second mask base substrate having the second stepped groove thereon.

9 more elements

Dependencies are inferred from the claim text.

Facts

Application: 15/864,472Filed 8 Jan 2018
Priority: KR 10-2017-009225820 Jul 2017
Published: US 2019/0027686 A124 Jan 2019
Granted: 26 May 2020
Term ends: Not estimatedThe source records don’t support an estimate.

Classification15 codes

C23C 14/042
Coating on selected surface areas, e.g. using masks: using masks
G03F 7/038
Photosensitive materials: macromolecular compounds which are rendered insoluble or differentially wettable
G03F 7/039
Photosensitive materials: macromolecular compounds which are photodegradable, e.g. positive electron resists
G03F 7/094
Characterised by structural details, e.g. supports, auxiliary layers: multilayer resist systems, e.g. planarising layers