Elastic wave device
AssigneeMurata Manufacturing Co., Ltd.
InventorsKoji Yamamoto, Tsutomu Takai, Seiji Kai, Hisashi Yamazaki, Yuji Miwa, Takashi Yamane
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Abstract
An elastic wave device includes a lamination layer film including a piezoelectric thin film on a support substrate. The lamination layer film is not partially present in a region located in an outer side portion of a region where IDT electrodes are provided. A first insulation layer extends from at least a portion of a region where the lamination layer film is not present to an upper portion of the piezoelectric thin film. A wiring electrode extends from the upper portion of the piezoelectric thin film to an upper portion of the first insulation layer, and extends onto a section of the first insulation layer in the region.
Claims18
An elastic wave device comprising:
- a support substrate;
- a lamination layer film provided on the support substrate and including a plurality of films including a piezoelectric thin film;
- an interdigital transducer (IDT) electrode provided on one surface of the piezoelectric thin film;
- a first insulation layer provided in a region located at an outer side portion of a region where the IDT electrode is provided and extending from at least a portion of a region where the lamination layer film is not present to an upper portion of the piezoelectric thin film in a plan view;
- and
- a wiring electrode electrically connected to the IDT electrode, extending from the upper portion of the piezoelectric thin film to an upper portion of the first insulation layer, and extending onto a section of the first insulation layer positioned in the region where the lamination layer film is not present.
Dependencies are inferred from the claim text.