Semiconductor mold compound transfer system and associated methods
AssigneeMicron Technology, Inc.
InventorsKean Tat Koh, Lien Wah Choong
Life of this patent
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Abstract
Mold compound transfer systems and methods for making mold compound transfer systems are disclosed herein. A method configured in accordance with a particular embodiment includes providing a sheet mold compound, and dispensing a granular mold compound directly on the sheet mold compound. The sheet mold compound can have a first density and the overall granular mold compound can have a second density less than the first density. The method further comprises transferring the solid sheet carrying the dispensed granular mold compound to a molding machine without using a release film.
Claims18
A mold compound transfer system, comprising:
- a sheet mold compound;
- and
- a granular mold compound comprising a plurality of individual grains directly on the sheet mold compound and spanning across at least a portion of the sheet mold compound;
- wherein:
- a combined thickness of the sheet mold compound and the granular mold compound is greater than or equal to 3 millimeters.
A mold compound transfer system comprising:
- a sheet mold compound;
- and
- a granular mold compound comprising a plurality of individual grains directly on the sheet mold compound and spanning across at least a portion of the sheet mold compound;
- wherein:
- the sheet mold compound has a first thickness and the granular mold compound has a second thickness less than the first thickness.
A method of transferring a mold compound without using a release film, the method comprising:
- providing a solid sheet comprising a first mold material;
- dispensing grains directly on the solid sheet such that the solid sheet carries the solid grains, wherein the grains comprise a second mold material;
- and
- transferring the solid sheet carrying the dispensed grains to a molding machine;
- wherein:
- a combined thickness of the solid sheet and the dispensed grains is greater than or equal to 3 millimeters.
A method of transferring a mold compound without using a release film, the method comprising:
- providing a solid sheet comprising a first mold material;
- dispensing grains directly on the solid sheet such that the solid sheet carries the solid grains, wherein the grains comprise a second mold material;
- transferring the solid sheet carrying the dispensed grains to a molding machine;
- and
- reflowing the solid sheet and dispensed grains to form a uniform mold material over the wafer.
A method of forming a molded semiconductor wafer, the method comprising:
- providing a solid sheet of first mold compound;
- placing grains of second mold compound directly on the solid sheet such that the grains are carried by the solid sheet;
- and
- processing the grains of the second mold compound in a molding machine to form a hybrid mold compound including the solid sheet of first mold compound and a pressed layer of the second mold compound;
- wherein:
- based at least in part on a first weight of the first mold compound, determining a second weight of the second mold compound to be placed over the first mold compound.
Dependencies are inferred from the claim text.