Methods and system for controlling a surface profile of a wafer
AssigneeGlobalWafers Co., Ltd.
InventorsPeter D. Albrecht, Carlos Zavattari, Sumeet S. Bhagavat, Vandan Tanna, Uwe Hermes
Life of this patent
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Abstract
Methods for controlling the surface profiles of wafers sliced from an ingot with a wire saw include measuring an amount of displacement of a sidewall of a frame of the wire saw. The sidewall is connected to a bearing of a wire guide supporting a wire web in the wire saw. Based on the measured amount of displacement of the sidewall, a pressure profile for adjusting a position of the sidewall is determined by a computing device. Pressure is applied to the sidewall using a displacement device according to the determined pressure profile to control the position of the sidewall.
Claims22
A method for controlling a surface profile of a wafer sliced from an ingot with a wire saw, the method comprising:
- measuring an amount of displacement of a sidewall of a frame of the wire saw, the sidewall connected to a bearing of a wire guide supporting a wire web in the wire saw;
- determining a pressure profile for adjusting a position of the sidewall based on measured amount of displacement of the sidewall;
- and
- applying pressure to the sidewall with a mechanical actuator according to the determined pressure profile to control the position of the sidewall.
A method for controlling a surface profile of a wafer during a cutting operation of an ingot, the method comprising:
- initiating the cutting operation on the ingot using a wire saw to produce the wafer;
- measuring, in real-time during the cutting operation, an amount of displacement of a sidewall of a frame of the wire saw, the sidewall connected to a bearing of a wire guide supporting a wire web in the wire saw;
- and
- applying, in real-time during the cutting operation, an amount of pressure to the sidewall with a mechanical actuator based on the measured amount of displacement of the sidewall, wherein application of the amount of pressure facilitates counteracting the measured amount of displacement of the sidewall.
A system for controlling a surface profile of a wafer sliced from an ingot with a wire saw, the system comprising:
- a sensor for measuring an amount of displacement of a sidewall of a frame of the wire saw, the sidewall connected to a bearing of a wire guide supporting a wire web in the wire saw;
- a mechanical actuator connected to the sidewall;
- and
- a computing device connected in communication to the sensor and the mechanical actuator, the computing device comprising a memory and a processor, the processor configured to:
- receive, in real-time during a cutting operation, the measured amount of displacement of the sidewall from the sensor;
- and
- transmit, in real-time during the cutting operation, a control signal to the mechanical actuator to apply an amount of pressure to the sidewall with the mechanical actuator based on the measured amount of displacement of the sidewall to control a position of the sidewall.
Dependencies are inferred from the claim text.