Structure having circuit board disposed on upper face of shield can disposed on circuit board, and electronic device including same

An electronic device comprising:

• at least one first circuit component;
• at least one second circuit component;
• a first circuit board on which the at least one first circuit component and a first connector electrically connected to the at least one circuit component are mounted;
• a shield can including an upper face including at least one opening, the shield can further comprising a side face surrounding the upper face of the shield can, the shield can being disposed on the first circuit board to accommodate the at least one first circuit component in an inner space of the shield can defined by the upper face and the side face, the side face being electrically connected to a first ground portion of the first circuit board;
• a second circuit board on which the at least one second circuit component and a second connector electrically connected to the at least one second circuit component are mounted, the second circuit board being disposed on the upper face of the shield can such that the at least one second circuit component is stacked on the at least one circuit component in the inner space through the at least one opening wherein the second connector is electrically coupled to the first connector;
• and
• a conductive adhesive disposed between the upper face and the second circuit board.

An electronic device comprising:

• a housing including a first plate oriented in a first direction, a second plate oriented in a second direction opposite the first direction, and a side face surrounding a space between the first plate and the second plate;
• a display exposed through at least a part of the first plate;
• a first circuit board disposed in the space and including a first communication module comprising communication circuitry configured to process a communication signal of a first frequency band and a first connector electrically connected to the first communication module;
• a second circuit board disposed to face at least a partial area of the first circuit board and including a second communication module comprising communication circuitry configured to process a communication signal of a second frequency band and a second connector electrically connected to the second communication module;
• a shield can disposed between the first circuit board and the second circuit board and including at least one opening;
• and
• a conductive adhesive bonding the second circuit board and the shield can to each other,
• wherein the second communication module is disposed in an inner space defined by the shield can through the at least one opening to be stacked on the first communication module and/or at least one component mounted on the first circuit board, and the first connector and the second connector are stacked to be electrically connected to each other.