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US 10,653,037 B2Granted
Thermal interface material structures
AssigneeInternational Business Machines Corporation
InventorsMark K. Hoffmeyer, Phillip V. Mann
Life of this patent
Estimating the term…
Abstract
In an example, a thermal interface material (TIM) structure is disclosed. The TIM structure includes a first thermal interface material layer comprising a gap filler material and a second thermal interface material layer comprising a solid thermal pad. The TIM structure has one or more overlapping regions associated with partial overlap of a surface of the gap filler material by the solid thermal pad such that a portion of the surface is exposed.
Claims13
A thermal interface material (TIM) structure comprising:
- a first thermal interface material layer comprising a gap filler material in contact with a heat transfer component;
- and
- a second thermal interface material layer comprising a solid thermal pad and disposed between the first thermal interface material layer and an electronic component,
- wherein the TIM structure has one or more overlapping regions associated with partial overlap of a surface of the gap filler material by the solid thermal pad such that a portion of the surface of the gap filler is exposed to a surface of the electronic component that is in contact with the solid thermal pad.
1 more element
An apparatus comprising:
- an electronic component;
- a heat transfer component;
- and
- a thermal interface material (TIM) structure disposed between the electronic component and the heat transfer component, the TIM structure including:
- a first thermal interface material layer comprising a gap filler material in contact with the heat transfer component;
- and
- a second thermal interface material layer comprising a solid thermal pad and disposed between the first thermal interface material layer and the electronic component,
- wherein the TIM structure has one or more overlapping regions associated with partial overlap of a surface of the gap filler material by the solid thermal pad such that a portion of the surface of the gap filler is exposed to a surface of the electronic component that is in contact with the solid thermal pad.
5 more elements
Dependencies are inferred from the claim text.