Electronic device and manufacturing method thereof

A manufacturing method of an electronic device, comprising steps of:

• forming at least a thin-film conductive line on a substrate by a thin-film process;
• forming at least an electrical connection pad on the substrate by a printing process, wherein the electrical connection pad is electrically connected with the thin-film conductive line;
• and
• disposing at least an electronic element on the substrate, wherein the electronic element is electrically connected with the thin-film conductive line through the electrical connection pad,
• wherein the electronic element is electrically connected with the electrical connection pad by eutectic bonding, the electrical connection pad directly contacts the thin-film conductive line, a thickness of the electrical connection pad is between 3 μm and 20 μm, a porosity of the electrical connection pad is greater than or equal to 5%, and is less than or equal to 40%.