Method for manufacturing circuit board

A method for manufacturing the circuit board comprising:

• providing an insulating substrate, and defining at least one through-hole on the insulating substrate to extend through two opposite surfaces of the insulating substrate;
• forming a silver layer on each of the two opposite surfaces, and forming a silver conductive structure in each of the at least one through-hole connecting the silver layers;
• forming a copper wiring layer on the silver layers to cover each silver conductive structure and a portion region of the silver layers;
• and
• etching the silver layers to form a silver wiring layer corresponding to the copper wiring layer, wherein a first etching liquid, which does not etch the copper wiring layer, is used for etching the silver layers;
• a width of each line of the silver wiring layer is less than a width of a corresponding line of the copper wiring layer, and a spacing between two lines of the silver wiring layer is greater than a spacing between two corresponding lines of the copper wiring layer.