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US 10,653,009 B1Granted
Component carrier with improved toughness factor
AssigneeAT&S (China) Co. Ltd.
InventorsArtan Baftiri, Mikael Tuominen
Life of this patent
Estimating the term…
Abstract
A component carrier is provided, which includes a stack having at least one electrically conductive layer structure and/or at least one electrically insulating layer structure; a component on the stack; and stress propagation suppressing particles in at least part of the stack suppressing propagation of stress through the component carrier.
Claims19
A component carrier, comprising:
- a stack comprising at least one electrically conductive layer structure and/or at least one electrically insulating layer structure;
- a component on the stack;
- and stress propagation suppressing particles in at least part of the stack suppressing propagation of stress through the component carrier, wherein the stress propagation suppressing particles are contained in at least part of at least one electrically insulating layer structure, in at least part of at least one electrically conductive layer structure and in at least part of electrically conductive connections, in particular electrically conductive connections to the component.
Dependencies are inferred from the claim text.