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US 10,653,004 B2Granted
Electronic assembly
AssigneeTactotek Oy
InventorsMikko Heikkinen, Jarmo Sääski
Life of this patent
Estimating the term…
Abstract
An electronic assembly includes a substrate film for accommodating electronics, an electrical contact pad coupled to the substrate film, an electrically conductive member coupled to the electrical contact pad, and a material layer molded onto the substrate film to embed the elastic electrically conductive member.
Claims5
An electronic assembly comprising:
- a first substrate film;
- a first electrical contact pad coupled to the first substrate film;
- a second material layer including molded material;
- and
- an electrically conductive member coupled to the first electrical contact pad and extending from the first electrical contact pad through the second material layer, wherein a second end of the electrically conductive member protrudes from the second material layer, such that the second end of the electrically conductive member is accessible and configured to provide an electrical connection through the second material layer to the first electrical contact pad and a first end of the electrically conductive member is covered by the first substrate film, wherein an intermediate portion of the electrically conductive member is embedded in the second material layer, wherein the electrically conductive member includes a spring loaded connector.
2 more elements
Dependencies are inferred from the claim text.