Multilayer ceramic electronic package with modulated mesh topology

An electronic system for reducing signal crosstalk between adjacent signal wires within an electronic package, the system comprising:

• the electronic package electrically and mechanically connected to a printed circuit board (PCB), the electronic package including:
• a wiring plane located in a coplanar orientation between an upper mesh plane and a lower mesh plane, the wiring plane including a set of adjacent signal wires, each signal wire of the set of adjacent signal wires extending parallel to a first axis and electrically insulated by a dielectric layer;
• the upper mesh plane that includes:
• a first set of wires, each wire of the first set of wires extending parallel to the first axis;
• and
• a second set of wires, each wire of the second set of wires:
• extending parallel to a second axis that is orthogonal to the first axis;
• intersecting with and electrically interconnected to the first set of wires;
• and
• electrically insulated from the wiring plane by a dielectric layer;
• and
• the lower mesh plane that includes:
• a third set of wires, each wire of the third set of wires extending parallel to the first axis;
• and
• a fourth set of wires, each wire of the fourth set of wires:
• extending parallel to the second axis;
• intersecting with and electrically interconnected to the third set of wires;
• and
• electrically insulated from the wiring plane by a dielectric layer;
• and
• a first region of the upper and lower mesh planes, wherein adjacent wires of the second set of wires are separated by a first distance and corresponding adjacent wires of the fourth set of wires are separated by the first distance;
• a second region of the upper and lower mesh planes, wherein adjacent wires of the second set of wires are separated by a second distance that is greater than the first distance and corresponding adjacent wires of the fourth set of wires are separated by the second distance;
• and
• an integrated circuit (IC) electrically and mechanically connected to the electronic package;
• and
• the PCB.

A computer-implemented method for designing and fabricating a multilayer ceramic (MLC) electronic package having modulated mesh planes, the method comprising:

• receiving, with an electronic design automation (EDA) program, a design for a multilayer ceramic electronic package having uniform mesh planes;
• determining, with an electromagnetic structure simulation program, far-end crosstalk (FEXT) between adjacent signal wires within the design for the MLC electronic package;
• modifying, with a layout editing program, in response to the FEXT for the design being above a crosstalk threshold, the design by modulating the uniform mesh planes in a direction parallel to the adjacent signal wires within the design to create a modified design having modulated mesh planes;
• and
• fabricating, at a manufacturing facility, the MLC electronic package in accordance with the modified design, the modified design of the electronic package including modulated mesh planes.