Formable shielding film

A shielded electronic system comprising:

• a circuit board;
• a plurality of discrete spaced apart electronic devices mounted on the circuit board;
• and
• a multilayer shielding film disposed on and covering the electronic devices and comprising:
• a structured adhesive layer comprising a pattern of adhesive material;
• an electrically conductive shielding layer disposed on and extending laterally beyond the structured adhesive layer;
• an electrically insulative thermally conductive layer disposed between the electrically conductive shielding layer and the structured adhesive layer and coextensive with the structured adhesive layer, such that the pattern of adhesive material of the structured adhesive layer covers some, but not all, of the thermally conductive layer;
• and
• an electrically conductive adhesive layer disposed between the electrically conductive shielding layer and the thermally conductive layer and coextensive with the electrically conductive shielding layer, such that, under application of one or more of heat, vacuum, and pressure, the shielding film is adapted to substantially conform to each electronic device, and the electrically conductive adhesive layer is adapted to adhere to the circuit board and provide a seal between the shielding film and the circuit board, the structured adhesive layer disposed on each electronic device, the shielding film physically contacting the circuit board between at least two neighboring electronic devices.

A multilayer shielding film comprising:

• a structured adhesive layer comprising a pattern of adhesive material;
• an electrically conductive shielding layer disposed on and extending laterally beyond the structured adhesive layer;
• an electrically insulative thermally conductive layer disposed between the electrically conductive shielding layer and the structured adhesive layer and coextensive with the structured adhesive layer, such that the pattern of adhesive material of the structured adhesive layer covers some, but not all, of the thermally conductive layer;
• and
• an electrically conductive adhesive layer disposed between the electrically conductive shielding layer and the thermally conductive layer and coextensive with the electrically conductive shielding layer, such that under application of one or more of heat, vacuum, and pressure, the shielding film is adapted to substantially conform and adhere to at least 90% of an exposed outermost surface of a three dimensional object mounted on a substrate, the object having a maximum width d and a minimum height h, h/d being at least 3, the conformed electrically conductive adhesive layer adhering to the substrate to maintain conformity of the shielding film to the object, the structured adhesive layer disposed on at least a portion of a surface of the object.