Circuit assembly with increased mounting area
AssigneesAutonetworks Technologies, Ltd., Sumitomo Wiring Systems, Ltd., Sumitomo Electric Industries, Ltd.
InventorsArinobu Nakamura, Tou Chin
Life of this patent
Estimating the term…
Abstract
Provided is a circuit assembly in which the mounting area of a substrate can be increased. A circuit assembly includes an electronic component having a plurality of terminals, a conductive member for supporting the electronic component (10), at least one of the terminals of the electronic component being electrically connected to the conductive member, and a substrate provided with a conductive pattern to which another terminal of the electronic component is electrically connected, in which the substrate is fixed to a surface of the conductive member that is opposite to a surface of the conductive member that supports the electronic component.
Claims8
A circuit assembly comprising:
- an electronic component having a main body and a plurality of terminals disposed on an undersurface of the main body;
- a plurality of bus bars spaced apart from each other, a pair of the plurality of bus bars spaced apart from each other so as to define a gap, the pair of bus bars supporting the electronic component, at least one of the terminals of the electronic component being electrically connected to one of the pair of bus bars, an end portion of the main body of the electric component is mounted to the one of the pair of bus bars and another end portion of the main body of the electronic component is mounted to the other of the pair of bus bars so as to have a mid-portion of the main body of the electric component disposed above the gap;
- and
- a substrate provided with a conductive pattern to which another terminal or other terminals of the electronic component are electrically connected,
- wherein the substrate is fixed to a surface of the pair of bus bars that is opposite to a surface of the pair of bus bars that supports the electronic component, and
- the circuit assembly is provided with a heat dissipation member that is in direct or indirect contact with the surface of the pair of bus bars that supports the electronic component.
Dependencies are inferred from the claim text.