Thermoelectric device cooling system
AssigneeII-Vi Delaware, Inc.
InventorJoshua E. Moczygemba
Life of this patent
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Abstract
A thermoelectric cooling system includes at least one thermoelectric cooling module and an electronic circuit. The at least one thermoelectric cooling module is arranged in at least one zone. The electronic circuit is electrically coupled to at least one of the thermoelectric cooling modules. Each of the thermoelectric cooling modules includes a first plate, a sink, a plurality of thermoelectric elements, and a second plate. The thermoelectric elements are coupled to the first plate and the second plate. The first plate is arranged to be thermally coupled to a first surface. The sink is arranged to be thermally coupled to an environment and is configured to dissipate heat by evaporating a liquid from the sink to the environment. The second plate is arranged to be thermally coupled to the sink.
Claims20
A system, comprising:
- at least one thermoelectric cooling module arranged in at least one zone, each thermoelectric cooling module comprising:
- a first plate, the first plate arranged to be thermally coupled to a first surface;
- a sink, the sink arranged to be thermally coupled to an environment to provide an open system, the sink evaporating a liquid from the sink to the environment;
- a second plate, the second plate arranged to be thermally coupled to the sink;
- and
- a plurality of thermoelectric elements, the plurality of thermoelectric elements coupled to the first plate and the second plate;
- and
- an electronic circuit, the electronic circuit electrically coupled to at least one of the plurality of thermoelectric cooling modules.
A method, comprising:
- electrically coupling an electronic circuit to at least one thermoelectric cooling modules arranged in at least one zone, each thermoelectric cooling module comprising:
- a first plate, the first plate arranged to be thermally coupled to a first surface;
- a sink, the sink arranged to be thermally coupled to an environment to provide an open system, the sink evaporating a liquid from the sink to the environment;
- a second plate, the second plate arranged to be thermally coupled to the sink;
- and
- a plurality of thermoelectric elements, the plurality of thermoelectric elements coupled to the first plate and the second plate.
A system, comprising:
- at least one thermoelectric cooling module arranged in at least one zone, each thermoelectric cooling module comprising:
- a first plate, the first plate arranged to be thermally coupled to a first surface:
- a sink, the sink arranged to be thermally coupled to an environment to provide an open system, the sink evaporating a liquid from the sink to the environment;
- a second plate, the second plate arranged to be thermally coupled to the sink;
- and
- a plurality of thermoelectric elements, the plurality of thermoelectric elements coupled to the first plate and the second plate;
- an electronic circuit, the electronic circuit electrically coupled to at least one of the plurality of thermoelectric cooling modules;
- a reservoir, the reservoir arranged to hold the liquid;
- and
- a wick coupled to the reservoir and the sink, the wick arranged to transfer liquid from the reservoir to the sink, the wick being coated with a polymer;
- and
- a battery electrically coupled to the electronic circuit.
Dependencies are inferred from the claim text.