Printed circuit board, method for manufacturing the same and electronic device

An electronic device, comprising:

• a core board assembly comprising a first core board and a second core board successively disposed together, wherein the second core board comprises a grounding layer formed on a side of the second core board towards the first core board, and the first core board defines a through slot;
• a radiator disposed in the through slot;
• a conductive adhering layer disposed between the grounding layer and the first radiator and configured to stick the radiator on the metal layer;
• and
• a heating component;
• wherein the core board assembly further defines an installation slot, wherein the installation slot extends through the second core board, and the heating component is installed in the installation slot to be in contact with the conductive adhering layer;
• or the installation slot extends through the second core board and the conductive adhering layer, and the heating component is installed in the installation slot to be in contact with the radiator.

A method for manufacturing a printed circuit board (PCB), comprising:

• providing a first core board, a second core board, a radiator and conductive adhering material, wherein the second core board comprises a metal layer disposed on a side of the second core board;
• slotting the first core board to from a first through slot extending through the first core board;
• covering at least a portion of a surface of the radiator or a portion of a surface of the metal layer with the conductive adhering material;
• placing the radiator in the first through slot so as to stick the radiator on the metal layer;
• and
• compressing the first core board, the second core board, the radiator and the conductive adhering material to form the PCB;
• after the compressing the first core board, the second core board, the radiator and the conductive adhering material to form the PCB, forming on the core board assembly an installation slot extending through the second core board and corresponding to a location of the radiator;
• wherein the installation slot extends through the conductive adhering material and up to a surface of the radiator or into the radiator.