LED display structures and fabrication of same
AssigneeLumiode, Inc.
InventorsVincent Lee, Ioannis Kymissis, Brian Tull
Life of this patent
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AssigneeLumiode, Inc.
InventorsVincent Lee, Ioannis Kymissis, Brian Tull
Estimating the term…
LED structures (e.g., LED arrays) and fabrication methods can reduce or even eliminate deep etching, and associated defect formation, proximate sites of individual LEDs. Such approaches can achieve desired electrical isolation without deep etching, provide a high conductivity current spreading layer, and, or reduce losses otherwise associated with conventional fabrication approaches. Some implementations advantageously lift off or separate an insulating substrate from a wafer to expose a bottom surface of the epitaxial LED layer and forms a backside contact (e.g., ground plane) overlying the bottom surface. Other implementations isolate deep etching away from sensitive regions and locate the backside contact on a top surface of the epitaxial LED layer. Some implementations form light extraction features (e.g., photonic crystals) on the exposed bottom surface. The top surface of the epitaxial LED layer may be undoped to improve electrical isolation. The bottom surface of may be shallow etched to improve light extraction.
A method of fabricating a light emitting diode structure, the method comprising:
A light emitting diode (LED) structure, comprising:
A light emitting diode (LED) structure, comprising:
Dependencies are inferred from the claim text.