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US 10,651,892 B1Granted
Structures for cross-talk reduction
AssigneeKeyssa Systems, Inc.
InventorsAhmed Khidre, Mohamed Sameh Mahmoud, Eric Sweetman
Life of this patent
Estimating the term…
Abstract
Systems and apparatuses for electromagnetic communications are provided. One of the apparatuses includes a housing portion for an electronic device, wherein the housing portion comprises: a first region formed from a first material; and a second region comprising an arrangement of structures formed from the first material and a second material, wherein the arrangement of structures reduce propagation of electromagnetic radiation propagating through the second region.
Claims18
An apparatus comprising:
- a communications module comprising two or more integrated circuit packages each integrated circuit package including at least one transmitter, receiver, or transceiver;
- and
- a device housing portion for an electronic device, wherein the housing portion comprises a planar portion substantially parallel to a communications module of the device, the planar portion of the housing comprising:
- a first region formed from a first material and configured to be in a transmission path of a first electromagnetic signal, associated with a first integrated circuit package, when transmitted to or from the device;
- a second region formed from the first material and configured to be in the transmission path of a second electromagnetic signal, associated with a second integrated circuit package, when transmitted to or from the device;
- and
- a third region comprising an arrangement of structures formed from a plurality of segments of the first material and a plurality of segments of a second material, wherein the first material has a first dielectric constant that allows propagation of electromagnetic signals and the second material has a second dielectric constant, wherein the arrangement of the first material and the second material provides a bandpass filter of electromagnetic signals.
4 more elements
An apparatus, comprising:
- a device housing portion for an electronic device, wherein the housing portion comprises a planar portion substantially parallel to a communications module of the device, the planar portion of the housing comprising:
- a first region formed from a first material and configured to be in a transmission path of electromagnetic signals, associated with a corresponding integrated circuit packages, when transmitted to or from the device;
- a second region comprising an arrangement of structures formed from a plurality of segments of the first material and a plurality of segments of a second material, wherein the first material has a first dielectric constant that allows propagation of electromagnetic signals and the second material has a second dielectric constant, wherein the arrangement of the first material and the second material provides a bandpass filter of electromagnetic signals.
Dependencies are inferred from the claim text.