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US 10,651,817 B2Granted
Bulk acoustic wave resonator on a stress isolated platform
AssigneeTexas Instruments Incorporated
InventorsTing-Ta Yen, Brian Goodlin, Ricky Alan Jackson, Nicholas Stephen Dellas
Life of this patent
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Abstract
In described examples of a micromechanical system (MEMS), a rigid cantilevered platform is formed on a base substrate. The cantilevered platform is anchored to the base substrate by only a single anchor point. A MEMS resonator is formed on the cantilevered platform.
Claims24
An integrated circuit package, comprising:
- an integrated circuit (IC) die including semiconductor circuitry formed thereon;
- a micromechanical system (MEMS) die mounted on the IC die;
- the MEMS die including a first portion and a second portion, the second portion including a cantilevered platform attached to the first portion, the first portion and the second portion composed of a same material;
- and
- a MEMS resonator directly attached to the cantilevered platform, the cantilevered platform including a distal end interfacing with the first portion and a proximal end opposite the distal end, wherein the MEMS resonator is directly attached proximal to the distal end, and wherein the distal end interfacing with the first portion includes silicon.
2 more elements
A semiconductor package comprising:
- a first die including a first portion and a second portion, the second portion including a cantilevered platform attached to the first portion, the first portion and the second portion composed of a same material;
- and
- a resonator directly attached to the cantilevered platform, the cantilevered platform including a distal end interfacing with the first portion and a proximal end opposite the distal end, wherein the resonator is directly attached to the cantilevered platform proximal to the distal end.
A semiconductor package, comprising:
- an integrated circuit (IC) die;
- a micromechanical system (MEMS) die mounted on the IC die, the MEMS die including a first portion and a second portion, the second portion including a distal end and a proximal end, the proximal end attached to the first portion, wherein the first portion and the second portion are composed of a same material;
- and
- a resonator directly attached proximate to the distal end than the proximal end.
1 more element
Dependencies are inferred from the claim text.