Packaged semiconductor devices with wireless charging means
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChen-Hua Yu, Hao-Yi Tsai, Tzu-Sung Huang, Ming-Hung Tseng, Hung-Yi Kuo
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Abstract
A semiconductor device package is provided, including a semiconductor device, a magnetic flux generation unit, a molding material, and a conductive slot. The magnetic flux generation unit is surrounding an axis and configured to produce magnetic flux passes through the magnetic flux generation unit. The molding material is surrounding the semiconductor device and the magnetic flux generation unit. The conductive slot is positioned over the molding material, wherein an opening is formed on the conductive slot, and the axis passes through the opening.
Claims20
A semiconductor device package, comprising:
- a semiconductor device;
- a coil configured to receive magnetic flux;
- a molding material surrounding the semiconductor device;
- and
- a conductive slot provided within a dielectric layer that is adjacent to the molding material, wherein the conductive slot has an opening, and the semiconductor device and the coil are disposed on a same side of the dielectric layer.
An electronic apparatus, comprising;
- a housing;
- a power source positioned in the housing;
- and
- a semiconductor device package positioned in the housing, wherein the semiconductor device package includes:
- a molding material surrounding a semiconductor device;
- and
- a conductive slot provided within a dielectric layer that is adjacent to the molding material, wherein the conductive slot has an opening, and a through hole is formed on the housing, wherein the conductive slot comprises an opening arranged corresponding to the through hole.
A semiconductor device package, comprising:
- a semiconductor device;
- a coil configured to receive magnetic flux;
- a molding material surrounding the semiconductor device;
- and
- a conductive slot provided adjacent to the semiconductor device and within a dielectric layer, wherein the conductive slot has an opening and a channel that extends from an edge of the conductive slot to the opening, and the semiconductor device and the coil are disposed on a same side of the dielectric layer.
Dependencies are inferred from the claim text.