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US 10,651,624 B2Granted
Optoelectronic modules having features for improved alignment and reduced tilt
Assigneeams Sensors Singapore Pte. Ltd.
InventorsMatthias Gloor, Yit Chee Chiang
Life of this patent
Estimating the term…
Abstract
This disclosure describes an optoelectronic to provide ultra-precise and stable packaging for an optoelectronic device such as a light emitter or light detector. The module includes spacers to establish precise separation distances between various parts of the module. One of the spacers serves as a support or mount for an optical element that comprises a mask.
Claims17
An optoelectronic module comprising:
- an electrically conductive trace;
- an optoelectronic device mounted on the electrically conductive trace and being operable to emit or detect light;
- an optical element having a mask disposed over the optoelectronic device;
- an optical sub-assembly disposed over the optical element;
- a first spacer in direct contact with an upper surface of the optical element, the first spacer establishing a distance between the optical element and the optical sub-assembly;
- a second spacer that supports the optical element, the second spacer being in direct contact with an upper surface of the trace and establishing a distance between the trace and the optical element;
- wherein the first and second spacers are attached to one another by adhesive, and
- the optical element is disposed within a recess in the second spacer and is supported by direct contact with surfaces of the second spacer.
5 more elements
A method of manufacturing an optoelectronic module, the method comprising:
- providing an assembly comprising:
- an optical element having a mask;
- an optical sub-assembly disposed over the optical element;
- a first spacer in direct contact with an upper surface of the optical element, the first spacer establishing a distance between the optical element and the optical sub-assembly;
- a second spacer that supports the optical element, wherein the first and second spacers are attached to one another by adhesive, and the optical element is disposed within a recess in the second spacer and is supported by direct contact with surfaces of the second spacer;
- performing optical testing of the assembly;
- and
- attaching the assembly to a sub-assembly that comprises an optoelectronic device mounted on an electrically conductive trace, wherein the optoelectronic device is operable to emit or detect light, and the electrically conductive trace is on an electrically insulating substrate, wherein attaching the assembly to the sub-assembly includes:
- bringing alignment surfaces of the second spacer into direct contact with an upper surface of the electrically conductive trace;
- and
- attaching the second spacer to the substrate by adhesive.
8 more elements
Dependencies are inferred from the claim text.