Receptacle connector equipped with cable instead of mounting to PCB
AssigneesFoxconn (Kunshan) Computer Connector Co., Ltd., Foxconn Interconnect Technology Limited
InventorTerrance F. Little
Life of this patent
Estimating the term…
Abstract
A QSFP-DD receptacle connector received within a cage includes an insulative housing and a contact module assembly received within the housing. The contact module includes a plurality of horizontal wafers stacked with one another, and each wafer includes an insulator and a plurality of contacts integrally formed therein wherein each contact has a front contact sections extending forwardly into a mating cavity formed in the housing, and a rear connecting section connected to a cable rather than to the printed circuit board. The receptacle connector associated with a cable is attached to a chassis. The cage optionally forms therein two mating spaces respectively receiving two receptacle connectors with the associated cables extending rearwardly.
Claims20
An interconnection system comprising:
- a metallic cage attached to a chassis and forming a receiving space therein;
- and
- a receptacle connector assembly secured to the cage and received in a rear portion of the receiving space, said receptacle connector comprising:
- an insulative housing;
- a contact module disposed in the housing and including opposite upper subassembly and lower subassembly assemble stacked with each other in a vertical direction, each of said upper subassembly and said lower subassembly including an upper wafer and a lower wafer, each of the upper wafer and the lower wafer including a plurality of contacts including grounding contacts, high speed differential pair contacts and low speed contacts, each of said contacts including a rear connecting section;
- and
- a plurality of cables comprising high speed cables and low speed cables connected with the connecting sections of the high speed contacts and low speed contacts, respectively.
An electrical connector comprising:
- an insulative housing;
- a contact module disposed in the housing and including opposite upper subassembly and lower subassembly stacked with each other in a vertical direction, each of said upper subassembly and said lower subassembly including a front/outer wafer and a rear/inner wafer stacked with each other in the vertical direction, each of said front/outer wafer and said rear/inner wafer including a plurality of contacts including grounding contacts, high speed differential pair contacts and low speed contacts, each of said contacts including a rear connecting section, wherein
- the rear connecting sections of the front/outer wafer are located in front of those of the rear/inner wafer in a front-to-back direction perpendicular to said vertical direction, and are respectively offset from those of the rear/inner wafer in a transverse direction perpendicular to both said vertical direction and said front-to-back direction.
An electrical connector comprising:
- an insulative housing;
- a contact module disposed in the housing and including opposite upper subassembly and lower subassembly stacked with each other in a vertical direction, each of said upper subassembly and said lower subassembly including a front/outer wafer and a rear/inner wafer stacked with each other in the vertical direction, each of said front/outer wafer and said rear/inner wafer including a plurality of contacts including grounding contacts, high speed differential pair contacts and low speed contacts, each of said contacts including a rear connecting section, wherein a plurality of cables including a plurality of high speed cables and a plurality of cables respectively mechanically and electrically connected to the connecting sections of the corresponding high speed differential pair contacts and those of the low speed contacts;
- wherein
- the connecting sections of the low speed contacts of the front/outer wafer of the lower subassembly extend downwardly in the vertical direction while those of the upper subassembly extend upwardly in the vertical direction.
Dependencies are inferred from the claim text.