Seal for an earthing bond
AssigneeDubuis et Cie S.A.S.
InventorsVincent Cerfeuillet, Mickael Cumant
Life of this patent
Estimating the term…
Abstract
This invention relates to an earthing bond seal for sealing between a flanged bush of an earthing bond and a substrate with which the flanged bush is to form an electrical connection, the seal comprising: an upper surface for engagement with the flange of the bush; a lower surface for engagement with the substrate; and an opening extending between the upper and lower surfaces, wherein the upper surface is provided with a first recess configured to receive the flange of the bush.
Claims15
A seal for sealing between a flange extending radially from a bush of an earthing bond and a substrate with which the bush is to form an electrical connection, the seal comprising:
- an upper surface for engagement with the flange of the bush;
- a lower surface for engagement with the substrate;
- and
- an opening extending between the upper and lower surfaces, and
- wherein the upper surface is provided with a first recess stepped so as to partially define an upper portion of larger diameter and lesser axial depth and a lower portion of smaller diameter and greater axial depth, and the lower portion is able to receive the flange of the bush.
A seal assembly for sealing between a flange extending radially from a bush of an earthing bond and a substrate with which the bush is to form an electrical connection, the seal assembly comprising:
- a seal including an upper surface for engagement with the flange of the bush, a lower surface for engagement with the substrate, an opening extending between the upper and lower surfaces, and the upper surface is provided with a recess stepped so as to partially define an upper portion of larger diameter and lesser axial depth and a lower portion of smaller diameter and greater axial depth, and the lower portion is configured to receive the flange of the bush;
- and
- a cap arranged to close the recess.
Dependencies are inferred from the claim text.