Unit cell antenna for phased arrays
AssigneeThe Boeing Company
InventorsAlec Adams, Lixin Cai
Life of this patent
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Abstract
Unit cells for phased array antennas are described. The unit cells include a plurality of dipole antennas that are used to form a phased array antenna. In particular, the unit cells that form the phased array antenna each include a plurality of dipole antennas formed on a surface of a substrate that are arranged to collectively form a triangle. A plurality of the unit cells may be linked together to form a triangular lattice array having almost any desired size and aperture, thereby allowing the RF engineer the freedom to achieve a wide variety of performance goals when designing a phased array antenna.
Claims17
A phased array antenna, comprising:
- at least one Printed Circuit Board (PCB) unit cell, comprising:
- a dielectric substrate having a first surface and a second surface opposing the first surface;
- a first metal film on the first surface;
- a second metal film on the second surface forming a ground plane;
- and
- a plurality of dipole antennas formed by the first metal film and arranged on the first surface to collectively form a triangle, wherein the plurality of dipole antennas comprises:
- a first dipole antenna having a first antenna element and second antenna element disposed along a first line;
- a second dipole antenna having a first antenna element and a second antenna element disposed along a second line, wherein the second line and the first line intersect;
- and
- a third dipole antenna having a first antenna element and a second antenna element disposed along a third line, wherein the third line and each of the first line and the second line intersect;
- a first set of vias underneath the first antenna element of each of the first dipole antenna, the second dipole antenna, and the third dipole antenna that electrically connects the first antenna element to the second metal film;
- and
- a second set of vias underneath and electrically connected to the second antenna element of each of the first dipole antenna, the second dipole antenna, and the third dipole antenna, wherein the second set of vias are electrically isolated from the second metal film, wherein the second set of vias comprise Radio Frequency (RF) feedlines for the first dipole antenna, the second dipole antenna, and the third dipole antenna.
A method of fabricating a Printed Circuit Board (PCB) unit cell for a phased array antenna, the method comprising:
- obtaining a dielectric substrate having a first surface and a second surface that opposes the first surface, wherein the first surface includes a first metal film and the second surface includes a second metal film forming a ground plane;
- and
- forming, from the first metal film, a plurality of dipole antennas that are arranged to collectively form a triangle by:
- forming a first dipole antenna having a first antenna element and second antenna element disposed along a first line;
- forming a second dipole antenna having a first antenna element and a second antenna element disposed along a second line;
- and
- forming a third dipole antenna having a first antenna element and a second antenna element disposed along a third line;
- forming a first set of vias underneath the first antenna element of each of the first dipole antenna, the second dipole antenna, and the third dipole antenna that electrically connects the first antenna element to the second metal film;
- and
- forming a second set of vias underneath and electrically connected to the second antenna element of each of the first dipole antenna, the second dipole antenna, and the third dipole antenna, wherein the second set of vias are electrically isolated from the second metal film, wherein the second set of vias comprise Radio Frequency (RF) feedlines for the first dipole antenna, the second dipole antenna, and the third dipole antenna.
A phased array antenna, comprising:
- a plurality of Printed Circuit Board (PCB) unit cells arranged in a common plane to form a Tightly Coupled Dipole Array (TCDA) having a triangular lattice, each of the plurality of PCB unit cells comprising:
- a dielectric substrate having a first surface and a second surface opposing the first surface;
- a first metal film on the first surface;
- a second metal film on the second surface forming a ground plane;
- a plurality of dipole antennas formed by the first metal film and arranged on the first surface to collectively form a triangle, wherein the plurality of dipole antennas comprises:
- a first dipole antenna having a first antenna element and second antenna element disposed along a first line;
- a second dipole antenna having a first antenna element and a second antenna element disposed along a second line, wherein the second line and the first line intersect;
- and
- a third dipole antenna having a first antenna element and a second antenna element disposed along a third line, wherein the third line and each of the first line and the second line intersect;
- a first set of vias underneath the first antenna element of each of the first dipole antenna, the second dipole antenna, and the third dipole antenna that electrically connects the first antenna element to the second metal film;
- and
- a second set of vias underneath and electrically connected to the second antenna element of each of the first dipole antenna, the second dipole antenna, and the third dipole antenna, wherein the second set of vias are electrically isolated from the second metal film, wherein the second set of vias comprise Radio Frequency (RF) feedlines for the first dipole antenna, the second dipole antenna, and the third dipole antenna.
Dependencies are inferred from the claim text.