Package integrated waveguide
AssigneeNXP USA, Inc.
InventorsScott M. Hayes, Walter Parmon
Life of this patent
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Abstract
A method of manufacturing a packaged semiconductor device including forming an assembly by coupling a semiconductor die and an antenna by way of a substrate, contacting with a conformal structure at least a portion of a first surface of the antenna, and encapsulating the assembly with an encapsulant such that the at least a portion of the first surface of the antenna contacted by the conformal structure is not encapsulated with the encapsulant.
Claims20
A method of manufacturing a packaged semiconductor device, the method comprising:
- forming an assembly by coupling a semiconductor die and an antenna by way of a substrate;
- contacting with a conformal structure at least a portion of a first surface of the antenna;
- and
- encapsulating the assembly with an encapsulant, the at least a portion of the first surface of the antenna contacted by the conformal structure not encapsulated with the encapsulant.
A packaged semiconductor device comprising:
- an assembly including:
- a semiconductor die having an active surface and a backside surface;
- an antenna having a first major surface and a second major surface;
- and
- a substrate configured to electrically couple a bond pad on the active surface of the semiconductor die with a terminal on the first major surface of the antenna;
- an encapsulant encapsulating a portion of the assembly;
- and
- an air cavity formed in the encapsulant exposing at least a portion of the second major surface of the antenna.
A method of manufacturing a packaged semiconductor device, the method comprising:
- forming an assembly by coupling a semiconductor die and an antenna by way of a substrate;
- contacting with a conformal structure at least a portion of a first surface of the antenna;
- and
- encapsulating the assembly with an encapsulant such that an air cavity is formed in the encapsulant exposing the at least a portion of the first surface of the antenna.
Dependencies are inferred from the claim text.