Packaged device including a transmission line associated with one of a conductive shield, vertical stubs, and vertically interdigitated stubs

A packaged device comprising:

• a first dielectric layer;
• a first transmission line formed over the first dielectric layer;
• a second dielectric layer formed over the first transmission line and the first dielectric layer;
• a plurality of vertically oriented stubs formed through the second dielectric layer and electrically coupled to the first transmission line;
• a second transmission line formed over the first dielectric layer, wherein the second transmission line is positioned next to the first transmission line;
• and
• a second plurality of vertically oriented stubs formed over the second transmission line, wherein the first plurality of vertically oriented stubs are interdigitated with the second plurality of vertically oriented stubs.

A packaged device comprising:

• a first dielectric layer;
• a first transmission line formed over the first dielectric layer, wherein the first transmission line has a first end and a second end opposite from the first end;
• a second dielectric layer formed over the first transmission line and the first dielectric layer;
• and
• a plurality of vertically oriented stubs formed through the second dielectric layer and electrically coupled to the first transmission line, wherein the plurality of vertically oriented stubs are set away from the first end and the second end.