Miniaturized electronics package with patterned thin film solid state battery

A method for integrating a thin film microbattery with electronic circuitry, the method comprising:

• forming a release layer over a handler;
• forming a thin film microbattery over the release layer of the handler;
• removing the thin film microbattery from the handler;
• depositing the thin film microbattery on an interposer;
• disposing electronic circuitry on the interposer, all the electronic circuitry being collinear with respect to each other and with the thin film microbattery;
• wherein the thin film microbattery is disposed directly between the electronic circuitry;
• and
• sealing the thin film microbattery and the electronic circuitry to create individual microbattery modules.