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US 10,651,361 B2Granted
Bumped resonator structure
AssigneeInternational Business Machines Corporation
InventorsMarkus Brink, Antonio D. Corcoles-Gonzalez, Jay M. Gambetta, Sami Rosenblatt, Firat Solgun
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Abstract
A technique relates a structure. An inductive element is on a first surface. A capacitive element is on the first surface and a second surface. An interconnect structure is between the first surface and the second surface.
Claims19
A structure comprising:
- an inductive element on a first surface;
- a capacitive element on the first surface and a second surface, such that an interconnect structure is positioned between the first surface and the second surface;
- and
- a qubit on the second surface.
1 more element
A structure comprising:
- an inductive element on a first surface;
- a capacitive element on the first surface and a second surface such that the capacitive element is separate from the inductive element, wherein a qubit is on the second surface;
- and
- an interconnect structure between the first surface and the second surface.
1 more element
A structure comprising:
- an inductive element on a first surface;
- a capacitive element on the first surface and a second surface such that the capacitive element is separate from the inductive element;
- and
- an interconnect structure between the first surface and the second surface, wherein the interconnect structure is a solder bump.
1 more element
Dependencies are inferred from the claim text.