Optoelectronic package with a low water vapor transmission rate (WVTR) and method for fabricating the same
AssigneeUnistars Corporation
InventorsShang-Yi Wu, Liang-Kuei Huang, Pao-Ya Wang
Life of this patent
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Abstract
An optoelectronic package includes a carrier, a light emitting die, a cover, and an encapsulation material. The carrier has a carrying plane and a wiring layer on the carrying plane. The light emitting die is mounted on the carrying plane and electrically connected to the wiring layer. The cover is connected to carrier. A cavity is formed between the cover and the carrier, and the light emitting die is within the cavity. The encapsulation material formed on the carrier surrounds the cover. The encapsulation material completely covers the interface between the cover and carrier.
Claims14
An optoelectronic package, comprising:
- a carrier, having a carrying plane and a wiring layer on the carrying plane;
- a light emitting die, mounted on the carrying plane and electrically connected to the wiring layer;
- a cover, connected to the carrier, wherein a cavity is formed between the cover and the carrier, and the light emitting die is within the cavity;
- and
- an encapsulation material, formed on the carrier and surrounding the cover, wherein the encapsulation material completely covers an interface between the cover and the carrier, and a water vapor transmission rate (WVTR) of the encapsulation material is less than 1 g/m2/day;
- wherein the carrier further has an outer-side surface and a ring-shape groove adjacent to the outer-side surface, wherein the encapsulation material fills the ring-shape groove and has an outer surface flush with the outer-side surface of the carrier.
A method for fabricating an optoelectronic package, comprising:
- providing a package group comprising a package substrate and a plurality of light emitting dies mounted on the package substrate;
- connecting a plurality of covers to the package substrate, wherein the covers separately cover the plurality of light emitting dies, and a plurality of trenches is formed between adjacent covers;
- forming an encapsulation material around each of the covers, wherein the encapsulation material fills the plurality of trenches and completely covers a plurality of interfaces formed between the package substrate and each of the covers, wherein a water vapor transmission rate (WVTR) of the encapsulation material is less than 1 g/m2/day;
- and
- dicing the package substrate along the trenches.
Dependencies are inferred from the claim text.